Features 1. Abundant Capabilities within Small Form Factors The IEI WAFER LX series is built within a 3.5¡± form factors measured 146x102mm with complete system functionalities while featuring flexibility, versatility, and enhanced capabilities. 2. LOW Power X86 Architecture The IEI WAFER-LX series runs current operating systems using the flexible x86 instruction set with low 6 Watt power consumption 3. Extended Connectivity Enhanced TTL, LVDS, SATA, and USB 2.0 interfaces for extended connectivity. 4. Green Product RoHS Compliance

Powerful capabilities with small form factor Small yet well beyond the confinement of the 3.5¡± layout, the WAFER LX sets a new standard for low consumption, performance, and reliability. Small Size, All-in-One Applications IEI WAFER LX series Approximate dimensions are 146mm x 102mm The 3.5¡± WAFER offers system designers enhanced flexibility, versatility and possibilities with implementations ¨C all in a small, industry-standard package. Complete NB Integrated Solution WAFER-LX Geode Link Bus Architecture   Traditional PC Bus V.S.. • Traditional PC Bus • Extremely Efficient • Centralized bus structure • Maximum performance • Minimum latency Single chip with complete NB integrated solution to provide direct performance and minimized power consumption Real-Time Power Consumption/ Thermal Test     WAFER-LX Extra Data Security RAID Raid 0 Raid 1 Minimum Disks Requirement 2 2 Capacity N N/2 Redundancy NO YES WAFER-LX RAID Function make a total security solution to you !!!     Storage Performance with Protection   System Configuration   Memory   PC 133 SO-DIMM 512MB HDD Western Digital 120GB SATA HDD Seagate 250GB O.S. Windows XP Embedded Power ACE-710AMP 100W IEI SATA RAID Storage Technology provides RAID capability, enabling faster storage performance with data striping with protecting against data loss from a hard drive failure by mirroring all data across multiple devices. HDD Mode IDE SATA RAID 0 RAID 1 JBOD Read Speed MB/s 31 51 82.1 50.8 50.3   RAID 0 is the performance side of the house.  RAID 0 or "striping" uses four/two drives in conjunction with one another for speed.         Thin Client Application in Tough Environment Why Thin Client? Special working environment applications demanded Size, Temp, User Account, Security, Cost sensitivity WAFER-LX Advantages • Traditional PC Bus • Extremely Efficient • Centralized bus structure • Maximum performance • Minimum latency   • Reduced Hardware Costs • Reduced Software Costs • Reduced Maintenance Costs • Prevent From Client Crash • Central Controlled Resources • Security Protection     Restaurant Thin Client Application System Front-end Hardware Advantages • Simple hardware structure • Small size for space saving • 0 to 60¡æ wide temp range • Ease of maintenance • Ease of management by adding or removing client WAFERs from the network   System Back-end Software Advantages • Client-Server embedded software instead of individual OS • Saves you more with more accounts, more users, and more software Security Cost saving Advantage •Centralized data control to prevent data loss •Simple firewall and virus protection saving your build up cost     System Architecture Free Administration Tool ICP RMT (Remote Management Tools) Ver. 1.0 Terminal Services Function •Applications run entirely on the Terminal Server. •The Remote Desktop client performs no local execution of application software. •The server transmits the graphical user interface to the client. •The client transmits the user's input back to the server. •SDKs for customers to program their application software in eVC++ or VB .NET Wake/Boot on Client Terminal Set Date & Time Configure FTP Check System Property Update Windows Base Terminal Remote Client Desktop     Client Tool Options Specialties •Extra Client Applications demands. •Multi-language support. •Web service off line support •Complex system demands Benefits •Shares server loading •Quick response action •Handles heavy system operation Specialties •Operation relies on Server •Web-based application system •Server-based computing system •No client software installation is required. Benefits •Simple architecture •Reduces software cost •Easy maintenances Windows XP embedded Thin Client Package •Windows XPE thin client OS image •Thin Client Protocols : MS-IE, RDP, ICA Windows CE •Ready-for-shipping Windows CE .NET 5.0 thin client OS image •Thin Client Shell •Touch drivers and soft-keypad •Servers and Services : FTP server, VNC server •Thin Client protocols : MS-IE, RDP, ICA   AMD Solution   Current Solution Entry-Level Solution Advanced Solution Model Name WAFER-5823 WAFER-GX466  WAFER-LX800 Form Factor  3.5"  3.5"  3.5" CPU AMD GX1-300 AMD GX466 AMD LX800 CPU Speed 300 MHz 333 MHz 500 MHz NB AMD GX1-300 AMD GX466 AMD LX800 SB AMD CS5530 AMD CS5536 AMD CS5536 Display CRT integrated in AMD GX1-300 18-bit TTL integrated in AMD GX1-300 18-bit  LVDS CRT integrated in AMD GX466 18-bit TTL integrated in AMD GX466 18-bit  LVDS CRT   integrated in AMD LX800 18-bit TTL integrated in AMD LX800 18-bit  LVDS Memory 1x PC 100/133 SO-DIMM upto 512MB 1x DDR266 SO-DIMM upto 1GB 1x DDR333/400 SO-DIMM upto 1GB SSD CFII CFII CFII LAN Dual  RTL8100B for 10/100Mbps Dual  RTL8100C for 10/100Mbps Dual  RTL8100C for 10/100Mbps COM 2x RS232 1x RS232, 1x RS232/422/485 1x RS232, 1x RS232/422/485 USB 2x USB 1.1 4x USB 2.0, 2 in rear, 2 by pin header 4x USB 2.0, 2 in rear, 2 by pin header IDE 1x IDE 1x IDE 1x IDE FDD 1x FDD 1x FDD 1x FDD LPT 1x LPT 1x LPT 1x LPT SATA N/A 2x SATA 2x SATA KB/MS PSII Mini DIMM PSII Mini DIMM PSII Mini DIMM

RoHS Compliance IEI is committed to compliance with all applicable laws and regulations, including the European Union Restriction of Hazardous Substances (RoHS) in electrical and electronic products. The goal is to exceed compliance obligations by meeting the requirements of the RoHS Directive on a worldwide basis. With IEI ' s new lead free production, all customers can start to work for their long term projects without worry about the RoHS regulation.

WAFER-LX Specifications CPU AMD® Geode LX-800 processor, 500MHz FSB System Chipset AMD® CS5536 BIOS AWARD System Memory 1 x 200-pin DDR 333/400MHz SO-DIMM SDRAM socket support up to 1GB Ethernet 10/100Base-T dual RTL8100C I/O I/O Interface 4 x USB 2.0 2 x SATA 1 x LPT/FDD 1 x CFII 2 x RS-232, 1 x RS-232/422/485 1 x PS/2 keyboard/mouse Super I/O W83627HG Audio AC¡¯97 Codec Realtek ALC202A Display CRT integrated in AMD® Geode LX800 TTL/ LVDS 18-bit single channel TFT LCD Watchdog Timer Software programmable supports 1~255 sec. system reset Power Supply +5V¡À 5%, AT/ATX power support Power Consumption +5V@1.2A (AMD LX 800 with DDR400 1GB RAM) Temperature Operation: 0 ~ 60º (32 ~ 140ºF) Humidity Operation: 5% ~ 95% Dimension 145(W)mm X 102(L)mm Weight GW: 670g; NW: 230g WAFER-LX Ordering Information Packing List 1 x WAFER-LX800 single board computer 1 x Audio cable (P/N: 32000-072100-RS) 1 x Mini jumper pack 1 x Second serial port cable (P/N: 32200-000061-RS) 1 x IDE flat cable 44p/40p/40p (P/N: 32200-000009-RS) 1 x PS/2 KB/MS cable (P/N: 32000-000138-RS) 2 x SATA cable (P/N: 32000-0628000-RS) 1 x Utility CD 1 x SATA power cable (P/N: 32100-086600-RS) 1 x QIG (quick installation guide) Ordering Information Part No. Description WAFER-LX-800-R10 3.5" SBC with AMD LX 800 processor, Audio, CRT, LCD/LVDS, Dual LAN and SATA connectors WAFER-LX-WINXPE 3.5" SBC with AMD LX 800 processor,256 DDR SO-DIMM Memory , Audio, CRT, LCD/LVDS, Dual LAN , SATA, IFM 512MB and Windows® XPE image WAFER-LX-CENET050 3.5" SBC with AMD LX 800 processor,256 DDR SO-DIMM Memory, Audio, CRT, LCD/LVDS, Dual LAN , SATA, IFM 32MB and Windows® CE 5.0 image WAFER-LX-CLIENT-XPE 3.5" SBC with AMD LX 800 processor,256 DDR SO-DIMM Memory , Audio, CRT, LCD/LVDS, Dual LAN , SATA, IFM 512MB, Windows® XPE imageand thin client package. WAFER-LX-CLIENT-CENET050 3.5" SBC with AMD LX 800 processor,256 DDR SO-DIMM Memory , Audio, CRT, LCD/LVDS, Dual LAN , SATA, IFM 64MB, Windows® CE 5.0 imageimage and thin client package. 32200-015100-RS LPT cable